Ultra Fine Copper Powder Isotope represents premium high-purity copper (Cu) in ultrafine particulate form, with precise isotopic composition for advanced nanotechnology, microelectronics, and isotope-specific research applications. This specialized powder achieves 99.999%+ purity, featuring natural copper isotopes Cu-63 (89.10%) and Cu-65 (30.90%), with average particle sizes of 1-7 microns and spherical morphology. Impurities (e.g., Mg, Al, Fe, Ni) total under 0.001%, ensuring oxygen-free, high-surface-area material resistant to oxidation.
Exceptional conductivity and malleability suit electrical contacts, catalysts, and MIM processes, while isotopic precision enables nuclear, medical imaging, and superconductivity research. Ultrafine size enhances sintering, dispersion in inks/pastes, and antibacterial properties for coatings.
High purity and uniform particle size ensure consistent performance in precision manufacturing. It exhibits low oxidation, excellent sinterability, and retains copper's natural strength without degradation in high-temperature environments. Apparent density ranges from 0.5-1.8 g/cc, with D50 sizes as fine as 0.3-10 μm depending on grade.
Deployed in microelectronics (conductive pastes), military friction components, chemical catalysts, metal injection molding, and nanotechnology; also microbiology and sintered magnets.
